Display devices and methods for manufacturing the same

ABSTRACT

A method for manufacturing a display device is provided. The method includes providing an array module having at least one first alignment mark. The method also includes providing a light-emitting module having at least one second alignment mark. The method further includes aligning the light-emitting module and the array module by the at least one first alignment mark and the at least one second alignment mark. In addition, the method includes bonding the light-emitting module onto the array module.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. patent application Ser. No.16/242,228, filed Jan. 8, 2019 and entitled “Display devices and methodsfor manufacturing the same”, the entirety of which is incorporated byreference herein.

BACKGROUND Field of the Disclosure

The embodiments of the disclosure relate to a display device, and inparticular to a display device with an alignment mark on alight-emitting module.

Description of the Related Art

The display devices are becoming more widely used. Since mass productionhas recently become the tendency in the light-emitting diode industry,any increase in the yield of manufacturing light-emitting diodes, suchas increasing the alignment accuracy. Therefore, the manufacturingmethod for the display devices may need to be continuously improved.

SUMMARY

A method for manufacturing a display device is provided. The methodincludes providing an array module having at least one first alignmentmark. The method also includes providing a light-emitting module havingat least one second alignment mark. The method further includes aligningthe light-emitting module and the array module by the first alignmentmark and the second alignment mark. In addition, the method includesbonding the light-emitting module onto the array module.

A display device is provided. The display device includes an arraymodule having a first alignment mark. The array module includes a firstsubstrate and a circuit layer disposed on the first substrate. The arraymodule also includes a plurality of pads disposed on the circuit layer.The display device also includes a light-emitting module having a secondalignment mark. The light-emitting module includes a second substrateand a plurality of light-emitting elements. The plurality oflight-emitting elements disposed on the second substrate andelectrically connected to the plurality of pads. The second alignmentmark is aligned with the first alignment mark.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a flow chart for manufacturing a display device in accordancewith some embodiments of the present disclosure;

FIGS. 2A-2G are top views of various stages of a process formanufacturing a display device in accordance with some embodiments ofthe present disclosure;

FIGS. 3A-3D are cross-sectional views of various stages of a process formanufacturing a display device in accordance with some embodiments ofthe present disclosure;

FIGS. 4A and 4B are top views of a first alignment and a secondalignment of a display device in accordance with some embodiments of thepresent disclosure;

FIGS. 5-8 is a cross-sectional view of a display device in accordancewith some embodiments of the present disclosure;

FIG. 9A is a top view of a display device in accordance with someembodiments of the present disclosure;

FIGS. 9B and 9C are top views of light-emitting modules in accordancewith some embodiments of the present disclosure;

DETAILED DESCRIPTION OF THE DISCLOSURE

The display device of the present disclosure is described in detail inthe following description. The drawings of different embodiments may uselike and/or corresponding numerals to denote like and/or correspondingelements in order to clearly describe the present disclosure. However,the use of like and/or corresponding numerals in the drawings ofdifferent embodiments does not suggest any correlation between differentembodiments. In addition, in this specification, expressions such as“first material layer disposed on/over a second material layer”, mayindicate the direct contact of the first material layer and the secondmaterial layer, or it may indicate a non-contact state with one or moreintermediate layers between the first material layer and the secondmaterial layer. In the above situation, the first material layer may notbe in direct contact with the second material layer.

It should be noted that the elements or devices in the drawings of thepresent disclosure may be present in any form or configuration known tothose skilled in the art. In addition, the expression “a layer isdisposed above another layer”, “a layer is disposed on another layer”may indicate that the layer is in direct contact with the other layer,or that the layer is not in direct contact with the other layer, therebeing one or more intermediate layers disposed between the layer and theother layer.

The terms “about” and “substantially” typically mean +/−20% of thestated value, +/−10% of the stated value, +/−5% of the stated value,+/−3% of the stated value, +/−2% of the stated value, +/−1% of thestated value or +/−0.5% of the stated value. The stated value of thepresent disclosure is an approximate value. When there is no specificdescription, the stated value includes the meaning of “about” or“substantially”.

It should be understood that, although the terms first, second, thirdetc. may be used herein to describe various elements, components,regions, layers, portions and/or sections, these elements, components,regions, layers, portions and/or sections should not be limited by theseterms. These terms are only used to distinguish one element, component,region, layer, portion or section from another region, layer or section.Thus, a first element, component, region, layer, portion or sectiondiscussed below could be termed a second element, component, region,layer, portion or section without departing from the teachings of thepresent disclosure.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this disclosure belongs. It should be appreciated that,in each case, the term, which is defined in a commonly used dictionary,should be interpreted as having a meaning that conforms to the relativeskills of the present disclosure and the background or the context ofthe present disclosure, and should not be interpreted in an idealized oroverly formal manner unless so defined.

This description of the exemplary embodiments is intended to be read inconnection with the accompanying drawings, which are to be consideredpart of the entire written description. The drawings are not drawn toscale. In addition, structures and devices are shown schematically inorder to simplify the drawing.

In the description, relative terms such as “lower,” “upper,”“horizontal,” “vertical,”, “on,”, “above,” “below,” “up,” “down,” “top”and “bottom” as well as derivative thereof (e.g., “horizontally,”“downwardly,” “upwardly,” etc.) should be construed to refer to theorientation as then described or as shown in the drawing underdiscussion. These relative terms are for convenience of description anddo not require that the apparatus be constructed or operated in aparticular orientation. Terms concerning attachments, coupling and thelike, such as “connected” and “interconnected,” refer to a relationshipwherein structures are secured or attached to one another eitherdirectly or indirectly through intervening structures, as well as bothmovable or rigid attachments or relationships, unless expresslydescribed otherwise.

The present disclosure provides a method for manufacturing a displaydevice. Refer to FIG. 1, which is a flow chart 100 for manufacturing adisplay device. The flow chart 100 includes multiple steps 102, 104,106, 108, 110, 112 and 114. Each of steps may correspond to FIGS. 2A-2Gor FIGS. 3A-3D. FIGS. 2A-2G illustrate the steps in the top view. FIGS.3A-3D illustrate the steps in the cross-sectional view. In someembodiments, other steps may be appropriately added before or afterabove the steps. In some embodiments, the above partial steps may beappropriately deleted or replaced. In some embodiments, the abovesequence of steps can be changed or modulated as needed.

The method for manufacturing the display device includes the step 102 ofproviding an array module having at least one first alignment mark and alight-emitting module having at least one second alignment mark. Asshown in FIGS. 2A and 2B, an array module 200 and a light-emittingmodule 300 are provided. As shown in FIG. 2A, the array module 200includes a first substrate 210. The first substrate 210 may include aglass substrate, a ceramic substrate, a plastic substrate or anothersuitable substrate, but not limited. The first substrate 210 may includepolyimide (PI), polycarbonate (PC), or polyethylene terephthalate (PET),but not limited thereto. The array module 200 includes a plurality ofpads 220. The pads 220 are disposed on the first substrate 210. Thematerial of the pad 220 may include copper (Cu), aluminum (Al),molybdenum (Mo), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt),titanium (Ti), iridium (Ir), other suitable material, or the abovealloy, but is not limited. FIG. 2A illustrates a pixel P that maycorrespond to (or electrically connected to) six pads 220, and asub-pixel (correspond to one light-emitting elements 320) mayrespectively correspond to two pads 220, but is not limited thereto. Thedotted line may correspond to a position where the pixel (not shown inFIG. 2A) is expected to be bonded. As shown in FIG. 2B, one pixel P mayinclude three sub-pixels, and a sub-pixel may respectively correspond toor electrically connected to two pads 220 after bonding (subsequent step114 will be described). In other embodiments (not shown), a pixel P maycorrespond to (or electrically connected to) four pads 220, for example,one of the four pads 220 is a shared pad, the shared pad is electricallyconnected to three sub-pixels of the pixel P, and other pads mayrespectively correspond to (or electrically connected to) threesub-pixels with different colors. In some embodiments, at least part ofthe pixel P may overlap with corresponding pads 220 in Z direction, andZ direction may defined as a normal direction of the first substrate 210of the array module 200. In some embodiments (shown in FIG. 2A), thearray module 200 includes at least one first alignment mark 230 on thefirst substrate 210.

As shown in FIG. 2B, the light-emitting module 300 includes a secondsubstrate 310. The second substrate 310 may be a carrier substrate orgrowth substrate, but is not limited. In some embodiments, the secondsubstrate 310 may include a glass substrate, a ceramic substrate, aplastic substrate, a sapphire substrate or another suitable substrate,but is not limited. The growth substrate may include silicon or asapphire substrate, which includes alumina oxide, GaP, GaAs, AlGaAs,SiC, Si, or another suitable material, but is not limited.

The light-emitting module 300 includes a plurality of light-emittingelements 320. The light-emitting elements 320 may be disposed on thesecond substrate 310. The light-emitting element 320 may be a redsub-pixel, a green sub-pixel or a blue sub-pixel, an infrared (IR)sub-pixel, or other sub-pixel with other colors. In some embodiments,the light-emitting element 320 may include light-emitting diode (LED),micro LED (pLED), mini LED, quantum dot (QD), quantum dot LED (QLED orQDLED) or other suitable element, but is not limited. In someembodiments, the light-emitting element 320 may emit blue light (or UVlight), but is not limited. In some embodiments, the light-emittingelement 320 may respectively emit the light with different colors (suchas red, green, blue or other suitable colors). In some embodiments, thelight-emitting module 300 may include the light conversion elements, thelight conversion elements (such as quantum dot, but is not limited) maybe disposed on or adjacent to the light-emitting module 300.

As shown in FIG. 2B, the light-emitting module 300 includes at least onesecond alignment mark 330 on the second substrate 310. In someembodiments, at least one pixel P may be disposed between two adjacentsecond alignment marks 330, but not limited, the quantity of pixel P canbe adjusted as needed.

In some embodiments, the position of the second alignment mark 330 ofthe light-emitting module 300 may correspond to the position of thefirst alignment mark 230 of the array module 200. For example, foursecond alignment marks 330 of the light-emitting module 300 mayrespectively correspond to one of four first alignment marks 230 on theright part (or on the left part) of the array module 200, but notlimited. As shown in FIGS. 2A and 2B, there is a distance T1 between twoadjacent first alignment marks 230 along the X direction, and there is adistance T2 between two adjacent second alignment marks 330 along the Xdirection. X direction may be defined as a direction parallel to anextension direction of the long side of the first substrate 210, but notlimited. In some embodiments, the X direction may be defined as anarrangement direction of adjacent pixels. In some embodiments, the Xdirection may be defined as an arrangement direction of sub-pixels ofthe pixel P. Y direction may be perpendicular with Z direction and Xdirection. Distance T1 may be defined as a distance between a center ofone of the first alignment marks 230 and a center of another the firstalignment mark 230 adjacent to the one of the first alignment marks 230along the X direction (or Y direction). Distance T2 may be defined as adistance between a center of one of the second alignment marks 330 and acenter of another the second alignment marks 330 adjacent to the one ofthe second alignment marks 330 along the X direction(or Y direction). Insome embodiments, the ratio of the distance T1 to the distance T2 is ina range from 0.8 to 1.2, but not limited. In some embodiments, the ratioof the distance T1 to the distance T2 is in a range from 0.9 to 1.1. Inaddition, there is a distance T3 between two first alignment marks 230which are respectively disposed on two sides of a diagonal line of theright part (or the left part) of the first substrate 210, and there is adistance T4 between two second alignment marks 330 which arerespectively disposed on two sides of diagonal line of the secondsubstrate 310. Distance T3 may be defined as a distance between a centerof one of the first alignment marks 230 and a center of another firstalignment mark 230 along a direction of the diagonal line. Distance T4may be defined as a distance between a center of one of the secondalignment marks 330 and a center of another second alignment marks 330along a direction of the diagonal line. In some embodiments, the ratioof distance T3 to distance T4 is in a range from 0.8 to 1.2, but notlimited. In some embodiments, the ratio of distance T3 to distance T4 isin a range from 0.9 to 1.1. When the ratio of distance T3 to distance T4(or distance T1 to distance T2) is in the range mentioned above, theaccuracy of bonding the array module 200 and the light-emitting module300 may be increased.

In some embodiments, the distance between two adjacent first alignmentmarks 230 along the X direction is the same as or different from thedistance between two adjacent first alignment marks 230 along the Ydirection. In some embodiments, the distance between two adjacent secondalignment marks 330 along the X direction (such as distance T2) is thesame as or different from the distance between two adjacent secondalignment marks 330 along the Y direction.

As shown in FIG. 2B, the second alignment mark 330 has a width W1. Thelight-emitting element 320 has a width W2. The width W2 may be a maximumwidth of one of the light-emitting elements 320 in X direction. Thewidth W1 may be a maximum width of one of the second alignment mark 330in X direction. In some embodiments, the width W1 is less than or equalto the width W2. In some embodiments, the width W1 is greater than thewidth W2. In some embodiments, an area of the light-emitting element 320may be defined as a lighting area of one sub-pixel operating at ahighest grayscale in Z direction, but not limited. In some embodiments,an area of the light-emitting element 320 may defined as a lightingsurface (such top surface of the light-emitting element 320) of onesub-pixel, but not limited. In some embodiments, an area of thelight-emitting element 320 may be defined by the openings of the lightblocking layer 630 (shown in FIG. 5 to FIG. 6).

The method for manufacturing the display device includes the step 104that aligning the array module 200 and the light-emitting module 300 bythe first alignment mark 230 and the second alignment mark 330. As shownin FIG. 2C, the light-emitting module 300 may approach (or betransferred to) the right part (or left part) of the array module 200.

The method for manufacturing the display device includes the step 106that approaching the at least one second alignment mark 330 with the atleast one first alignment mark 230 into a detecting region S. Refer toFIG. 2D, which is an enlarged view of region R shown in FIG. 2C. Asshown in FIG. 2D, the detecting region S may be a region that can bedetected by a charge-coupled device (CCD) camera (not shown) or othersuitable image equipment (or camera equipment), but not limited. When atleast one of the second alignment mark 330 and the first alignment mark230 is outside the detecting region S, the light-emitting module 300 orthe array module 200 may be transferred, so that the second alignmentmark 330 and the first alignment mark 230 would be inside the detectingregion S.

The method for manufacturing the display device includes the step 108that detecting the distance between the second alignment mark 330 andthe first alignment mark 230, and comparing the distance with apredetermined value. In some embodiment, the distance between the secondalignment mark 330 and the first alignment mark 230 detected by the step108 may be defined as a mismatch between the second alignment mark 330and the first alignment mark 230. Refer to FIG. 2E, which is an enlargedview of the region R shown in FIG. 2C. After the second alignment mark330 and the first alignment mark 230 are inside the detecting region S,the distance between the first alignment mark 230 and the secondalignment mark 330 is detected by the CCD camera or other suitable imageequipment (or camera equipment), but not limited, and the distancebetween the first alignment mark 230 and the second alignment mark 330will be compared with the predetermined value. In some embodiments(shown in FIG. 2B), one pixel pitch P has a width W3, and thepredetermined value is less than or equal to half of the width W3. Thewidth W3 may be a distance between the centers (left sides or rightsides) of the two adjacent pixels P, but not limited. For example, thepixel pitch P may be a distance between the centers (left sides or rightsides) of two adjacent sub-pixels with the same color. That is, themismatch between the second alignment mark 330 and the first alignmentmark 230 is less than half of the pixel pitch P of the display device.

The method for manufacturing the display device includes the step 110that determining whether the distance (ex. mismatch) is less than orequal to the predetermined value. For example, the step 110 includesdetermining whether the distance (ex. mismatch) X1 along the X direction(or the distance (ex. mismatch) Y1 along the Y direction) is less thanor equal to the predetermined value.

If the distance X1 (or the distance Y1) is greater than thepredetermined value, the step 112 will be performed. The step 112includes reducing the distance between the second alignment mark 330 andthe first alignment mark 230. In addition, the step 112 includesadjusting the position of the array module 200 or the light-emittingmodule 300, so that the first alignment mark 230 would be aligned with(or overlapped with) the second alignment mark 330. In some embodiments,the step 112 includes approaching the array module 200 or thelight-emitting module 300 along the X direction (or the Y direction orother directions), so that the first alignment mark 230 would be alignedwith (or overlapped with) the second alignment mark 330, but notlimited. After the performing of the step 112, the step 108 is performedto detect the distance between the first alignment mark 230 and thesecond alignment mark 330 along the X direction (or the Y direction orother directions).

In some embodiments, if both the distance X1 and the distance Y1 areless than or equal to the predetermined value, the step 114 will beperformed. The step 114 includes bonding the light-emitting module 300onto the array module 200. As shown in FIG. 2F, after bonding thelight-emitting module 300 onto the array module 200, the secondsubstrate 310 may be disposed on the right part (left part or otherpart) of the first substrate 210, but not limited. Moreover, thelight-emitting elements 320 may be electrically connected to thecorresponding pad 220. In some embodiments, the light-emitting elements320 may respectively overlap with part of the corresponding pad 220 in Zdirection.

In some embodiments, the predetermined value is less than or equal tohalf of the width W3 of the pixel pitch P. In some embodiments, thepredetermined value is equal to the width W2. When the predeterminedvalue is in the range mentioned above, the production yield of bondingthe array module 200 and the light-emitting module 300 may be increased.

In some embodiments, the second substrate 310 may be removed (as shownin FIG. 2G), and the light-emitting elements 320 are disposed on (orbonded onto) the pad 220. In some embodiments, the second substrate 310may be removed by a laser or other suitable methods. In someembodiments, the second substrate 310 may not be removed, and the secondsubstrate 310 and the light-emitting elements 320 may disposed on thearray module 200. The process shown in FIGS. 2A-2G may be repeated sothat another light-emitting module 300 may be disposed on (or bonded on)the another part (such as left part) of the array module 200.

The process shown in FIGS. 2A-2G may be used in mass production of thedisplay device, but not limited. For example, nine pixels may bedisposed on (or bonded onto) the corresponding pads 220 in same bondingprocess, but not limited. In some embodiments, the second substrate 310may be used as a growth substrate, and the second alignment marks may bedisposed on (or formed on) the second substrate 310. In someembodiments, the second substrate 310 may be used as a carriersubstrate, and the light-emitting elements 320 may be transferred ontothe second substrate 310, and then transferred onto (or disposed on) thearray module 200, but not limited. In some embodiments, the quantity(number) of first alignment marks 230 may be greater than or equal tothe quantity (number) of the second alignment marks 330, but notlimited. In some embodiments, the light-emitting module 300 may havefour second alignment marks 330, and the four second alignment marks 330may respectively be disposed at four corners of the second substrate310, but not limited. In some embodiments, the quantity of the secondalignment marks 330 in light-emitting module 300 is greater than (orless than) four, and the second alignment marks 330 may be disposed atother suitable position of the second substrate 310. In someembodiments, the light-emitting module 300 has two second alignmentmarks 330, and two second alignment marks 330 may respectively bedisposed at two diagonal corners of the second substrate 310. In someembodiments, the light-emitting module 300 may have at least one secondalignment mark 330. The quantity of the first alignment marks 230 or theposition of the first alignment marks 230 may be correspond to thesecond alignment marks 330, which can be adjusted according to theneeds.

Refer to FIGS. 3A-3G, which are cross-sectional views of various stagesof a process for manufacturing the display device. In some embodiments,the array module 200 includes a circuit layer 240, and the circuit layer240 is disposed on (or formed on) the first substrate 210. Furthermore,the circuit layer 240 may include wires 250, other conductive elements(not shown), other dielectric layers (not shown), but not limited. Insome embodiments, the pads 220 may be disposed on (or electricallyconnected to) the circuit layer 240. In some embodiments (shown in FIG.3A), the first alignment mark 230 may be disposed on the circuit layer240. In some embodiments, the first alignment mark 230 may be disposedin (or formed in) the circuit layer 240 (not shown in FIGS. 3A-3G, butshown in FIG. 5). In some embodiments, the material of the wires 250 maybe the same as or different from the pads 220, the wires 250 or otherconductive elements of the circuit layer 240. In some embodiments, thefirst alignment mark 230 and the pads 220, the wires 250 or otherconductive elements of the circuit layer 240 may be formed in the sameprocess or different process, but not limited. In some embodiment, thefirst alignment mark 230 may be formed before the process of forming thecircuit layer 240. In some embodiment, the first alignment mark 230 maybe formed after the process of forming the pad 220. In some embodiment,the material of the first alignment mark 230 may include opaquematerials, shading materials, reflective materials or a combination ofthe above, but is not limited thereto. In some embodiment, the materialof the first alignment mark 230 may include metal material, metal alloy,black photoresist or other suitable material, but is not limitedthereto.

As shown in FIG. 3A, the light-emitting module 300 includes a pluralityof pads 322 disposed on the light-emitting element 320.

As shown in FIG. 3A, the distance D1 may be a distance between a centerof the first alignment mark 230 and a center of the second alignmentmark 330 along the X direction (or the Y direction). If the distance D1is greater than the predetermined value, the position of thelight-emitting module 300 will be fine-tuned.

As shown in FIGS. 3B, the position of the light-emitting module 300 isfine-tuned. If the distance D1 is less than or equal to thepredetermined value, the light-emitting module 300 is bonded onto thearray module 200 as shown in FIG. 3C. After the bonding process, thesecond alignment mark 330 may approximately overlap with the firstalignment mark 230 in Z direction, or the second alignment mark 330 mayapproximately aligned with the first alignment mark 230.

As shown in FIG. 3D, after the light-emitting module 300 is disposed on(or bonded onto) the array module 200, the second substrate 310 may beremoved, but not limited. The light-emitting elements 320 and the pads322 may be disposed on the array module 200. In some embodiment, thepads 322 of the light-emitting module 300 may electrically connected to(or contact with) the corresponding pads 220 of the array module 200. Insome embodiment, the light-emitting element 320 may be electricallyconnected to the pad 220 through the pad 322. If the distance D1 is lessthan or equal to the predetermined value, the production yield in massproducing the display device can increase.

Refer to FIGS. 4A and 4B, which are top views of a first alignment and asecond alignment in accordance with some embodiments. The profile of thefirst alignment marks and second alignment marks shown in FIGS. 4A and4B are merely examples, and the present disclosure is not limitedthereto. In some embodiments, the first alignment mark 230A and thesecond alignment mark 330A are in different shapes. In some embodiments,the second alignment mark 330A may be adjacent to the first alignmentmark 230A. In some embodiments, the second alignment mark 330A mayenclose the first alignment mark 230A, as shown in FIG. 4A. In someembodiments, the second alignment mark may have an opening O, at leastpart the opening O may overlap with the first alignment mark 230A in Zdirection, but not limited. In some embodiments, at least part of thesecond alignment mark 330A may overlap with at least part of the firstalignment mark 230A in Z direction. In some embodiments, the shape ofthe first alignment mark 230A and the shape of the second alignment mark330A may include rectangle, circle, triangle, polygon, arc shape, obtuseangle shape, acute angle shape, round shape or other suitable shapes,but is not limited. In some embodiments, the shape of the firstalignment mark 230A may be the same as or different from the shape ofthe second alignment mark 330A. In some embodiments, a distance dmbetween the second alignment mark 330A and the first alignment mark 230Ain X direction (or Y direction) is greater than or equal to 0, and lessthan or equal to the width W2 (shown in FIG. 2B). Distance dm may bedefined as the minimum distance between the second alignment mark 330Aand the first alignment mark 230A in X direction (or Y direction). Insome embodiments, the position of the first alignment mark 230A and theposition of the second alignment mark 330A can be exchanged.

In some embodiments, the second alignment mark 330B may havediscontinuous parts, as shown in FIG. 4B. In some embodiments, theprofile of the shape of the second alignment mark 330B is different fromor the same as the shape of the first alignment mark 230B. The firstalignment mark 230B may have a cross-shape, rectangular shape, polygonalshape, curved shape, circular shape, arc shape, obtuse angle shape,acute angle shape, round shape or other suitable shapes, but notlimited. In some embodiments, the first alignment mark 230B may includeprotruding portions. The second alignment mark 330B may be adjacent tothe first alignment mark 230B, and the second alignment mark 330B mayhave any shape correspond to (or in accordance with) the shape of thefirst alignment mark 230B, but not limited. For example, the secondalignment mark 330B may have an L-shape (or other shape) and extend intothe space between two adjacent protruding portions of the firstalignment mark 230B, but not limited. The above “the alignment mark 330Bhas any shape correspond to (or in accordance with) the shape of thefirst alignment mark 230B” includes that the alignment mark 330B has anyshape correspond to at least one side of the first alignment mark 230B.It should be noted that, one of the second alignment marks 330B may havediscontinuous parts, these parts may correspond to one of the firstalignment marks 230B, these parts can form a second alignment marks330B, and these parts may have similar or different shapes. In someembodiments, the position of the first alignment mark 230B and theposition of the second alignment mark 330B can be exchanged. In someembodiments, the shape of the first alignment mark 230B and the shape ofthe second alignment mark 330B may be complement each other.

Refer to FIG. 5, which is a cross-sectional view of a display device400A in accordance with some embodiments. The display device 400A mayinclude an array module 500 and a light-emitting module 600. The arraymodule 500 may include a substrate 502. The material of the substrate502 may be the same as or similar to the material of the first substrate210. In some embodiments, some insulating layers 504, 506, 508′, 508 maybe sequentially disposed on the substrate 502. The insulating layers504, 506, 508 may include, but are not limited to, silicon oxide,silicon nitride, silicon oxynitride or another suitable material.

A plurality of transistors 510 is disposed on the substrate 502. Thetransistor 510 may be a thin film transistor (TFT). For example, thetransistor 510 may include a gate electrode 512, a source/drainelectrode 518, and a semiconductor layer 516. The gate electrode 512 maybe disposed on the insulating layer 504 and the semiconductor layer 516.The source/drain electrode 518 may be disposed on the semiconductorlayer 516 and the doping layers 514, and the semiconductor layer 516 maybe disposed between the doping layers 514. The material of the gateelectrode 512 and the source/drain electrode 518 may include, but is notlimited to, copper (Cu), aluminum (Al), molybdenum (Mo), gold (Au),chromium (Cr), nickel (Ni), titanium (Ti), other suitable material oralloy. The material of the semiconductor layer 516 may include, but isnot limited to, amorphous silicon, polysilicon such as low-temppolysilicon (LTPS), metal oxide or other suitable materials. The metaloxide may include indium gallium zinc oxide (IGZO), indium zinc oxide(IZO), indium gallium zinc tin oxide (IGZTO) or other suitable material.

The array module 500 may include a plurality of wires 509 and pads 520.The pads 520 may be disposed on the insulating layer 508 and the wires509. The transistor 510 may be electrically connected to the pad 520through the wire 509, but not limited. The material of the wire 509 andthe pad 520 may be the same as or different from the material of thesource/drain electrode 518.

In some embodiments, the first alignment mark 522 may be disposed on theinsulating layer 504. In some embodiments, the first alignment mark 522and the gate electrode 512 may be formed in the same process. In someembodiments, the material of the first alignment mark 522 and thematerial of the gate electrode 512 may be same. In some embodiments, thefirst alignment mark 522 may include metal material that is disposed inthe insulating layer 506. In other embodiments, the first alignment mark522 and the pad 520 may be formed in the same process. In someembodiments, the material of the first alignment mark 522 and thematerial of the gate electrode 512 may be same. In other embodiments,the material of the first alignment mark 522 and the material ofsource/drain electrode 518 may be same.

As shown in FIG. 5, the light-emitting module 600 includes a substrate602. The substrate 602 may include a glass substrate, a ceramicsubstrate, a plastic substrate or another suitable substrate, but notlimited. The material of the substrate 602 may include sapphire, Si,SiC, other suitable materials or combinations thereof, but are notlimited thereto. In some embodiments, the light-emitting module 600 mayinclude insulating layers 604, 606, 608, and the insulating layers 604,606, 608 are disposed on the substrate 602. The insulating layers 604,606, 608 may include, but are not limited to, silicon oxide, siliconnitride, silicon oxynitride or another suitable material. Thelight-emitting module 600 may include a plurality of the transistors610. For example, the transistor 610 may include a gate electrode 612, asource/drain electrode 614, and a semiconductor layer 616. The gateelectrode 612 may be disposed on the insulating layer 604. The materialsof the gate electrode 612, the source/drain electrode 614 and thesemiconductor layer 616 may be the same as, similar to or different fromthose of the gate electrode 512, the source/drain electrode 518 and thesemiconductor layer 516, respectively. The light-emitting module 600includes a plurality of wires 618 and pads 620. In some embodiments, thetransistor 610 may be electrically connected to the pad 620 through thewire 618. In some embodiments, and the transistor 510 may beelectrically connected to the transistor 610. In some embodiments, thepad 520 may be electrically connected to (or contact with) the pad 620.In some embodiments, the transistor 610 may use as a driving transistor.In some embodiments, the transistor 510 may use as a switch transistor.In some embodiments, more transistors (or elements) may be disposed onthe substrate 602 or the substrate 502, such as reset transistor orcapacitor, but not limited. In some embodiments, the transistor 610 andthe transistor 510 may disposed on the same substrate (such as substrate602 or the substrate 502). The structure of the transistor 610 (or thetransistor 510) described above is an example, and the disclosure is notlimited thereto. In some embodiments, the transistor 610 (or thetransistor 510) can be top gate thin film transistor, bottom gate thinfilm transistor, double gate thin film transistor, but not limited. Inaddition, the transistor 610 (or the transistor 510) can includeamorphous germanium (a-Si:H) transistor, low temperature polycrystallinegermanium transistor (LTPS), indium gallium zinc oxide transistor (IGZO)or other suitable transistor, but not limited. The light-emittingelement 626 may be electrically connected to the transistor 610 and thetransistor 510 through the conductive elements which are disposed in thearray module 500 or the light-emitting module 600.

As shown in FIG. 5, the light-emitting module 600 includes insulatinglayer 622 and 624. The light-emitting module 600 includes a plurality oflight-emitting elements 626 and pads 628. In some embodiments, thelight-emitting element 626 and the pad 628 may be surrounded by theinsulating layer 622, but not limited. The insulating layers 622 may bedisposed to protect the light-emitting element 626 or the pad 628 fromdamage or pollution (such as water or air), but not limited. Thematerial of the insulating layer 622 (or the insulating layer 624) mayinclude, but is not limited to, resin or another suitable material. Thelight-emitting element 626 and the pad 628 may be the same as or similarto the light-emitting element 320 and the pad 322 shown in FIG. 3A,respectively. In some embodiments, the order of the above layers orelements can be changed or replaced as needed. In some embodiments, theabove layers can be replaced or removed as needed.

As shown in FIG. 5, the light-emitting module 600 includes a lightblocking layer 630. The light blocking layer 630 may be disposed on thelight-emitting element 626. The light blocking layer 630 has a pluralityof openings B-O, the openings B-O may overlap with the light-emittingelement 626 in Z direction. In some embodiments, the light blockinglayer 630 does not overlap with the light-emitting element 626 in Zdirection. The light-emitting module 600 may include a plurality oflight conversion layer 632. The light conversion layer 632 may bedisposed on (or cover) the light-emitting element 626. In someembodiments, the light conversion layer 632 may be adjacent to thelight-emitting element 626. The material of the light conversion layer632 may include, but is not limited to, quantum dot, fluorescentmaterial, phosphorescent material or another conversion material. Forexample, the light conversion layer 632 may be an organic or aninorganic layer blended with a quantum dot. The quantum dot may include,but is not limited to, zinc, cadmium, selenium, sulfur, InP, GaSb, GaAs,CdSe, CdS, ZnS or a combination thereof, but not limited.

The light-emitting module 600 further includes a protective layer 634and a color filter layer 636. The light-emitting element 626 may bedisposed between the protective layer 634 and the substrate 602. Thecolor filter layer 636 may be disposed between the light conversionlayer 632 and the protective layer 634, but not limited. The protectivelayer 634 may be single layer structure, multilayer structure, compositestructure, but not limited. The material of the protective layer 634 mayinclude organic material, inorganic material, or a combination thereof.In some embodiments, the material of the protective layer 634 may be atransparent substrate. In some embodiments, the material of theprotective layer 634 may include phosphosilicate glass (PSG),borophosphosilicate glass (BPSG), silicon oxide, silicon nitride, orsilicon oxynitride, but not limited. In some embodiments, the colorfilter layer 636 may be disposed on at least one of the light conversionlayer 632. In some embodiments, the color filter layer 636 may berespectively disposed on the corresponding light conversion layer 632.In some embodiments, the color filter layer 636 may overlap with atleast part of the light blocking layer 630 in Z direction in order toreduce light leakage. In some embodiments (not shown), the color filterlayer 636 may disposed between the light conversion layer 632 and thelight-emitting element 626.

In some embodiments, the second alignment mark may be disposed in (orformed in) the second substrate. For example (FIG. 5), the secondsubstrate 602 may be a transparent substrate or non-transparentsubstrate, a through hole TH may penetrate the second substrate 602, andthe through hole TH may be regarded as the second alignment mark 638. Insome embodiments, the through hole TH may penetrate at least part of thelayers (or the elements) formed on the second substrate 602. For example(shown as FIG. 5), the through hole TH may penetrate the secondsubstrate 602, the insulating layers 604, 606, 608, 622, 624, the lightblocking layer 630 and the protective layer 634, but not limited. Insome embodiments, in Z direction, a shape of the through hole TH mayinclude rectangle, circle, triangle, polygon, arc shape, obtuse angleshape, acute angle shape, round shape or other suitable shapes, but notlimited. In some embodiments, in the direction of the cross section, thethrough hole has an inverted trapezoid profile, rectangular profile orother shape profile, but not limited. However, the scope of thedisclosure is not limiting.

As shown in FIG. 5, the second alignment mark 638 approximately overlapwith (or aligned with) the first alignment mark 522 in Z direction. Thesecond alignment mark 638 (such as through hole TH) have a bottomsurface BS and top surface TS opposite to the bottom surface BS, and thebottom surface BS is near to the array module 500. In the cross section,the bottom surface BS of the second alignment mark 638 (such as throughhole TH) may have a length L1, and the top surface TS of the secondalignment mark 638 may have length L3. In some embodiments, the lengthL3 may be greater than or equal to the length L1. In some embodiments,the length L3 may be less than or equal to the length L1. In someembodiments, the length L3 also may be defined as the maximum length ofthe top surface TS of the second alignment mark 638 in top view, andlength L1 also may be defined as the maximum length of the bottomsurface BS of the second alignment mark 638 in top view.

As shown in FIG. 5, the cross section, the first alignment mark 522 hasa length L2. In some embodiments, the length L1 is greater than or equalto the length L2. The length L1 is greater than the length L2 so thatthe CCD camera could receive both images of the first alignment mark 522and the second alignment mark 638. In addition, there is an angle θconstituted by an extension direction of the side surface of the secondalignment mark 638 (such as through hole TH) and an extension directionof the bottom surface BS of the second alignment mark 638. In someembodiments, the angle θ may be in a range from about 30° to about 110°,but not limited. In some embodiments, the angle θ is in a range fromabout 50° to about 90°. In some embodiments, the angle θ is in a rangefrom about 70° to about 90°. In some embodiments, the side surface ofthe second alignment mark 638 (such as through hole TH) is a curved edgeor an irregular edge. For example, in the Z direction, viewers can seethe elements (such as first alignment mark 522 or other layers (orelements) of the array module 500) through the second alignment mark 638(through hole TH).

As shown in FIG. 5, at least one spacer 524 may be disposed between thearray module 500 and the light-emitting module 600. The spacer 524 mayinclude resin or other suitable materials, but not limited. In someembodiments, at least one space 526 may be formed between the arraymodule 500 and the light-emitting module 600 by the spacer 524. Thespace 526 may include air, transparent material or other suitablematerials, but not limited.

Refer to FIG. 6, which illustrates a cross-sectional view of a displaydevice 400B in accordance with some embodiments. In some embodiments,one of the differences between the display device 400B and the displaydevice 400A is that a second alignment mark 640 of the display device400A may include a filling materials FM, the filling materials FM may bedisposed in (or filled in) the through hole TH, and the through hole THwith the filling materials FM may be regarded as the second alignmentmark 330. In some embodiments, the filling materials may includetransparent material. The filling materials FM may include, but is notlimited to, silicon oxide, silicon nitride, silicon oxynitride oranother suitable material.

Refer to FIG. 7, which illustrates a cross-sectional view of a displaydevice 400C in accordance with some embodiments. In some embodiments,one of the differences between the display device 400C and the displaydevice 400A is that a notch 642 may penetrate part of layers (orelements) in the light-emitting module 600. In some embodiments (FIG.7), the notch 642 may penetrate the insulating layers 622, 624, thelight blocking layer 630 and the protective layer 634. The displaydevice 400C may include a second alignment mark 644. The material of thesecond alignment mark 644 may be the same as or similar to the materialof the gate electrode 612 of the transistor 610, but not limited. Insome embodiments, the second alignment mark 644 and a portion of thetransistor 610 (such as source/drain electrode 614) may be formed in thesame process or different process. In some embodiments, the material ofthe second alignment mark 644 may be the same as or different from thematerial of a portion of the transistor 610 (such as source/drainelectrode 614).

As shown in FIG. 7, the notch 642 has a bottom surface BS′, and thebottom surface BS′ is near to the array module 500. In the crosssection, the bottom surface BS′ of the notch 642 may have a length L1′.In some embodiments, the length L1′ also may be defined as the maximumlength of the bottom surface BS′ of the notch 642 in top view. As shownin FIG. 7, the second alignment mark 644 has length L4, the length L4may be defined as the maximum length of the second alignment mark 644 inX direction (or Y direction). In some embodiments, the length L4 is lessthan or equal to the length L1′. In some embodiments, at least part ofthe second alignment mark 644 may overlap with the first alignment mark522 in Z direction. In some embodiments, at least part of the secondalignment mark 644 may be aligned with the first alignment mark 522. Insome embodiments, the shape of the notch 642 may be the same as ordifferent from of shape of the second alignment mark 644 in Z direction.

Refer to FIG. 8, which illustrates a cross-sectional view of a displaydevice 400D in accordance with some embodiments. In some embodiments,one of the differences between the display device 400D and the displaydevice 400A is that the array module 500 of the display device 400D mayinclude a spacer 528 and a protruding portion 530 that is disposed onthe spacer 528. The protruding portion 530 may be regarded as the firstalignment mark of the array module 500. Moreover, the profile of asecond alignment mark 646 of the light-emitting module 600 may becorrespond to (or accordance with) the profile of the protruding portion530. The protruding portion 530 may protrude into the second alignmentmark 646 of the light-emitting module 600. In addition, the displaydevice 400 may include a plurality of solders 532 that are electricallyconnected to the pads 520 and the pads 620.

As shown in FIGS. 9A-9C, a display device 700 may include two or morelight-emitting modules with different arrangements. As shown in FIG. 9A,the display device 700 may include an active region 710 and a peripheralregion 720 that is adjacent to (or surrounds) the active region 710. Thedisplay device 700 may include a plurality of second alignment marks830A and 830B on the active region 710 and the peripheral region 720. Asshown in FIG. 9B, a light-emitting module 800A may have a secondsubstrate 810, light-emitting elements 820 and second alignment marks830A. As shown in FIG. 9C, a light-emitting module 800B may have asecond substrate 810, light-emitting elements 820 and second alignmentmarks 830B. One of the differences between the light-emitting module800A and the light-emitting module 800B is the arrangement of thelight-emitting elements 820. As shown in FIG. 9A, the display device 700may include a plurality of second alignment marks 830A of thelight-emitting module 800A and a plurality of second alignment marks830B of the light-emitting module 800B. The arrangement of thelight-emitting module 800A and the light-emitting module 800B may beadjusted according to the active region 710 and the peripheral region720. For example, the second alignment mark 830A may be disposed on theactive region 710 and the peripheral region 720. The second alignmentmark 830B may be disposed on the active region 710.

Although some embodiments of the present disclosure and their advantageshave been described in detail, it should be understood that variouschanges, substitutions and alterations can be made herein withoutdeparting from the spirit and scope of the disclosure as defined by theappended claims. For example, it will be readily understood by thoseskilled in the art that many of the features, functions, processes, andmaterials described herein may be varied while remaining within thescope of the present disclosure. Moreover, the scope of the presentapplication is not intended to be limited to the particular embodimentsof the process, machine, manufacture, composition of matter, means,methods and steps described in the specification. As one of ordinaryskill in the art will readily appreciate from the disclosure of thepresent disclosure, processes, machines, manufacture, compositions ofmatter, means, methods, or steps, presently existing or later to bedeveloped, that perform substantially the same function or achievesubstantially the same result as the corresponding embodiments describedherein may be utilized according to the present disclosure. Accordingly,the appended claims are intended to include within their scope suchprocesses, machines, manufacture, compositions of matter, means,methods, or steps.

What is claimed is:
 1. A method for manufacturing a display device,comprising: providing an array module having at least one firstalignment mark; providing a light-emitting module having at least onesecond alignment mark; aligning the light-emitting module and the arraymodule by the at least one first alignment mark and the at least onesecond alignment mark; and bonding the light-emitting module onto thearray module.
 2. The method as claimed in claim 1, wherein aligning thelight-emitting module and the array module comprises approaching the atleast one second alignment mark and the at least one first alignmentmark into a detecting region.
 3. The method as claimed in claim 2,wherein aligning the light-emitting module and the array modulecomprises, after approaching the at least one second alignment mark withthe at least one first alignment mark into the detecting region,detecting a distance between the at least one second alignment mark andthe at least one first alignment mark, and then comparing the distancewith a predetermined value.
 4. The method as claimed in claim 3, whereinaligning the light-emitting module and the array module comprises, aftercomparing the distance with the predetermined value, reducing thedistance until the distance is less than or equal to the predeterminedvalue if the distance is greater than the predetermined value.
 5. Themethod as claimed in claim 3, wherein the predetermined value is lessthan or equal to half of a pitch of the plurality of light-emittingelements.
 6. The method as claimed in claim 1, comprising: removing thesubstrate after bonding the light-emitting module onto the array module.7. The method as claimed in claim 1, wherein a quantity of firstalignment marks is